IBM and Mitsubishi Electric Prepare for 3G

IBM and Mitsubishi Electric Corporation have entered into a technology agreement intended to accelerate the introduction of high-performance, low-power microchips for third-generation (3G) cellular telephones.

Under the multi-year joint development agreement, IBM and Mitsubishi Electric are designing radio frequency integrated circuit (RFIC) chipsets for 3G wireless handsets. The highly-integrated chipsets will be based on Mitsubishi Electric's cellular circuit and system expertise, and manufactured by IBM using its silicon germanium (SiGe) communications chip technology. Mitsubishi Electric intends to incorporate the 3G RFICs into its next-generation cellular products.

The new SiGe chipsets IBM and Mitsubishi Electric are developing include 3G receiver and transmitter parts intended to efficiently manage high frequency signals, while reducing power consumption and overall system cost through high-levels of integration.

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